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Epo-Tek Conductive Silver Epoxy for Lab Applications

Ladd Research is pleased to introduce a new line of Epo-Tek Conductive Silver Epoxies from Epoxy Technology, one of the leading manufacturers of specialty adhesives for use in advanced technology applications. The worlds' most important companies in the electronics, medical device, semiconductor and fiber optics industries rely on Epoxy Technology's products for their superior quality and performance.

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LH81A - Epo-Tek H81A

LH81A - Epo-Tek H81A

Two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

Starting at: $5,350.00

Epo-Tek H22

Epo-Tek H22

Two component, silver-filled epoxy designed specifically for die bonding and sealing hybrid circuit packages. 1oz and 8oz sizes.

Starting at: $224.95

Epo-Tek 383ND

Epo-Tek 383ND

A slightly longer pot life version of L353ND. Designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber optic and medical industries.

Please Note:
This product is NOT conductive.

Starting at: $89.95

L353ND - Epo-Tek 353ND

L353ND - Epo-Tek 353ND

Non-conductive, two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic and medical applications. It is one of the most popular Epo-Tek brand products, and is known throughout the world for its performance and reliability. Please Note: This product is NOT conductive.
$169.95
LEJ2189-LV - Epo-Tek EJ2189-LV

LEJ2189-LV - Epo-Tek EJ2189-LV

Low viscosity, two-component, room temperature curing conductive epoxy.
$249.95
LEE129-4 - Epo-Tek EE129-4

LEE129-4 - Epo-Tek EE129-4

Two component, room temperature cure silver-filled epoxy, designed for making electrical connections in circuit assembly, semiconductor and LCD applications.
$209.95
LH21D - Epo-Tek H21D

LH21D - Epo-Tek H21D

Two component, high Tg, silver-filled epoxy adhesive designed for chip bonding in microelectronic and optoelectronic applications.
$229.95
LH20S - Epo-Tek H20S

LH20S - Epo-Tek H20S

A modified version of LH20E, designed primarily for die stamping and dispensing techniques for chip bonding. It is a highly reliable silver-filled epoxy with a smooth, thixotropic consistency. Very simple to use.
$239.95
LH20E - Epo-Tek H20E

LH20E - Epo-Tek H20E

Two component, 100% solids silver-filled epoxy designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity.
$240.00
LOG603 - Epo-Tek OG603

LOG603 - Epo-Tek OG603

A single component, low viscosity, UV curable adhesive designed for curing in seconds.
$194.95

10 Item(s)

per page

Grid List

Set Descending Direction

Electron Microscopy Supplies