Catalog Number: 60802
This is a 2-part, silver used in prototype, repair and general conductive bonding applications. This product features strong mechanical bonds, excellent electrical conductivity, and quick room temperature curing. Bonds aggressively to a wide variety of materials.
May be used for electronics applications including:
Conductive bonds between heat sensitive components
Solderless surface mount connections
Circuit board trace repair
Static discharge and grounding
Solder repair
Conductive structural adhesions
Specific Gravity: 2.85
Volume Resistivity: <0.001 ohm-cm
Thermal Conductivity: 11 BTU-in/ft2 – hr-°F
Operating Temperature Range: -131°F to 212°F
Lap Shear: >1200 lbs/in
Shore Hardness: >70
Dropping Point: None @ 650°F
Adhesion: Excellent
Cured Flexibility: Excellent
Chemical Resistance: Excellent
Moisture Resistance: Good
Typical Thickness: 5 mil
Shelf life: 12 months
Curing: Curing times and
electrical conductivity depend primarily on temperature. For fastest curing
times, maximum conductivity and adhesion, cure the bond between 150-250°F for
5-10 minutes. Conductive Silver Epoxy can be room temperature cured at or above
75°F
for 4 hours. Maximum conductivity and bond strength are achieved in 24 hours.
Curing at temperatures below 75°F will result in a loss of conductivity and adhesion.