LH21D - Epo-Tek H21D

Quick Overview

Two component, high Tg, silver-filled epoxy adhesive designed for chip bonding in microelectronic and optoelectronic applications.

sku: LH21D

Availability: In stock


Advantages & Application Notes:
-  Extended pot-life and can be cured at relatively low temperatures such as 80°C.
-  Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.
-  Contains no solvents or thinners. NASA approved, low outgassing epoxy – http://outgassing.nasa.gov/
-  Also suggested for hybrid - aerospace circuits found in Rf / Microwave devices like cockpits and satellites.
-  Paste-like rheology allows for application by commercial dispensing equipment, stamping, screen printing, or by hand with spatula or toothpick.
-  Compatible with Au-plated ceramic substrates found in traditional and custom hybrids.

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