Advantages & Suggested Application Notes:
- Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light Exposure. Suitable for LED encapsulation.
- Ease of use: potting and casting, encapsulation and adhesive.
- Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging.
- Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM/Scientific Instruments.
- Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove: spectral transmission of visible and IR light.
- BIOCOMPATIBLE and NON-TOXIC; Complies with ISO 10993 biocompatibility testing and certified for USP Class VI biocompatibility standards.
- Adhesion to glass, quartz, metals, wood and most plastics is very good.
- May also be used for impregnating wooden or porous objects for artifact restoration.
- NASA approved, low outgassing epoxy - http://outgassing.nasa.gov/
| SKU | L301-2x |
|---|---|
| Hazardous Materials | Yes |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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