Typical Applications
- Machining advanced ceramics
- Lapping and polishing optical components
- Dicing ceramic substrates and semiconductor wafers
- Dicing metal and optical single crystals
- Mounting cross sections for scanning electron microscopy
- Backfilling components for temporary mechanical support
- Dry plasma etching
CrystalbondTM 509 - Provides excellent adhesion and minimizes clogging of diamond tools compared to waxes. Transparent in thin cross-sections.
CrystalbondTM 555 - Low melting point adhesive system for moderate-stress machining processes, dry plasma etching of silicon wafers, de-paneling copper plated HCFC boards and dicing ceramic green tape. Transparent in thin cross sections.
CrystalbondTM 590 - High strength, resilient adhesive system, ideal for dicing miniature and tall parts.
Wafer-MountTM 559 - Semi-rigid, solvent-resistant plastic film with pressure sensitive soluble adhesive layer. Ideal for scribing wafers with vacuum hold down fixturing.
Wafer-MountTM 562 - Thermoplastic film adhesive with good adhesive properties. Ideal for mounting thin, fragile substrates for which a predictable film thickness is required.
| Product Specifications | |||||
| Trade Name | CrystalbondTM 509 | CrystalbondTM 555 | CrystalbondTM 590 | Wafer-MountTM 559 | Wafer-MountTM 562 |
| Form | Stick | Stick | Stick | Sheet | Sheet |
| Size | 7/8" diameter x 7" | 1/2" x 1" x 7" | 5/8" x 1 1/4" x 7 1/2" | .005" x 10" x 10" | .002" x 8" x 10" |
| Weight | ~.2 lbs/stick | ~.15 lbs/stick | ~.15 lbs/stick | N/A | N/A |
| Flow Point oC | 74oC | 54oC | 150oC | N/A | 93oC |
| Viscosity, cps | 6,000 | 500 | 9,000 | N/A | N/A |
| Color(s) | Light Amber , Dark Amber, Clear/Blue | White | Brown | White | Clear |
| Solvent | 509-S or Acetone | 509-S or Hot Water | 590-S or Isopropanol | Acetone or MEK | 562-S |
| SKU | 14500-21 |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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