Advantages & Application Notes:
- Extended pot-life and can be cured at relatively low temperatures such as 80°C.
- Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.
- Contains no solvents or thinners. NASA approved, low outgassing epoxy – http://outgassing.nasa.gov/
- Also suggested for hybrid - aerospace circuits found in Rf / Microwave devices like cockpits and satellites.
- Paste-like rheology allows for application by commercial dispensing equipment, stamping, screen printing, or by hand with spatula or toothpick.
- Compatible with Au-plated ceramic substrates found in traditional and custom hybrids.
| SKU | H21D |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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