EPO-TEK ® H22 Advantages & Application Notes:
- A smooth, free flowing, slightly thixotropic paste, using a 100% solids system. It can be dispensed, screen printed, or manually applied.
- High Tg allows it to be used for high temperature applications.
- Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.
- Extended pot life and fast curing at relatively low temperatures < 100°C.
- Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes.
- Contains no solvents or thinners. NASA approved, low outgassing epoxy – http://outgassing.nasa.gov/
- Can be used instead of eutectic solders for near-hermetic sealing.
| SKU | lh22-lh22-8 |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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