EPO-TEK® 353ND Advantages & Application Notes:
- Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
- NASA approved, low outgassing epoxy - http://outgassing.nasa.gov/
- Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging
- Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
- Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
- Medical suggested applications:
- Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including SST, diamond, titanium, brass, ceramics, glass and most plastics.
- Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires
- Electronics Assembly suggested applications:
- Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
- Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets
- This product has been tested and satisfies low halogen requirements
SKU | L353ND |
---|---|
Hazardous Materials | No |
Product Brand | --- None --- |
Featured Product | No |
Featured Order | No |