Advantages of Epo-Tek EK2000
- Low viscosity and high thixotropy make it ideal for dispensing.
- Two components for convenient shipping, but also available as a single component version (Epo-Tek EK1000) and Mil-STD 883 Test Method 5011 version (Epo-Tek EK1000-MP). Please call to inquire about these products.
- Alternative step cures can result in improved thermal management.
Suggested Applications
- Extreme thermal management in high brightness LEDs and high power communication die attach such as MMICS and GaN.
- Concentrated photo voltaic solar cells (CPV)
- Die attach in triple junction III-V semiconductor chips, offering extremely low thermal resistance.
- Favorable performance when compared to solder.
- Replacing vacuum preform solder manufacturing with lower temp/low stress high volume dispensing process.
| SKU | LEK2000 |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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