Epo-Tek H20E-PFC Electrically Conductive Silver Epoxy - 1oz

Advantages of Epo-Tek H20E-PFC

     - Product may be applied at the wafer level or single-chip bumping of prototypes.
     - Final system packaging can be hermetic micro-electronic cases or open-faced circuits using potting resin or housing.
     - Low temperature cure capable between 70 and 100 degrees Celsius allows for lower cost plastic substrates / housings to be used. 
     - Passes NASA low outgassing standard ASTM E595 with proper cure. Please click HERE for link.
     - Compatible with Au, Cu, Ag, Ag-Pd component or substrate metallization. 
     - Compatible with Automated dispensing equipment.

Suggested Applications

     - Stencil printing of small dots or "bumps" the size of 4 mil diameter with 8 mil pitch can be achieved.
     - Suggested for flip chip packaging applications found in memory devices (SDRAM, DRAM), watch modules, RFID tags, smart-cards, military and medical devices. 
     - Recommended to be used with chips or wafers which have UBM layer already deposited.