EPO-TEK® H20S Advantages & Application Notes:
- Especially recommended for use in high speed epoxy chip bonding systems where fast cures are highly desirable.
- Suggested for JEDEC Level III and II plastic IC packaging.
- The low temperature cure makes it ideal for flex circuitry and other low stress applications.
- It is used extensively for bonding quartz crystal oscillators and other stress sensitive chips.
- Used for die and SMD bonding inside hybrid/hermetic packages such as DIP and TO-Cans; also EMI/Rf shielding of micro-electronics.
- Ideal for making ITO electrical contacts in LCD packaging; and suggested for LED die-attach.
| SKU | LH20Sx |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
Write Your Own Review
