Epo-Tek H74 Thermally Conductive Epoxy

Quick Overview

LH74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation and hermetic sealing in general.

Availability: In stock

Product Name Price Qty
LH74 - Epo-Tek H74 - 3 oz kit
$149.95
LH74-16 - Epo-Tek H74 - 16 oz kit
$219.95
 

LH74 Advantages and Application Notes: 

  • - Thixotropic paste allows for good handling characteristics. The epoxy can be dispensed, screen printed or manually applied by toothpick or spatula.
  • - Outstanding high temperature properties and excellent solvent, chemical and moisture resistance.
  • - Reasonable working life with fast curing at relatively low temperatures <120°C. 
  • - Capable of providing a near-hermetic seal.
  • - Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/
  • - Built-in color indicator when the product is cured. This color change varies from a tan to brown, depending upon the curing conditions. It is normal for the epoxy to  turn a very dark red when subjected to wire bonding temperatures.
  • - Used in opto-packaging for sealing 1) fiber into the snout; 2) a ferrule seal to the package; or 3) a boot to the package. Commonly used with DIP or Buterfly packages or TO-cans.
SKU Epo-Tek H74
Hazardous Materials Yes
Product Brand --- None ---
Featured Product No
Featured Order No

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