Advantage of Epo-Tek 375 two part epoxy:
- Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
Semiconductor suggested applications: Wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices and resisting high temperature packaging.
- Down-hole petrochemical fiber optic sensors resisting >200 degree Celsius field conditions.
Fiber optic adhesive suggested applications:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800-1550nm range.
- Fiber component packaging, adhesive for active alignment of optics, environmental seal of opto package, V-groove arrays.
Electronics assembly suggested applications:
- Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
- Structural grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton and magnets.
| SKU | L375-1LB |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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