Epo-Tek H27D Advantages & Suggested Application Notes:
- Rheology provides a smooth paste with excellent handling characteristics and a reasonable pot life. It can be machine-dispensed, screen printed, stamped or applied by hand using spatula, toothpick or many other applicators.
- Suggested for the following:
- Semiconductor applications such as Au-plated chips, Si, GaAs, Cu or Ag based lead-frames and die-paddles, JEDEC plastic IC packaging using transfer molded encapsulation processes.
- Hybrid micro-electronics; active and passive SMDs on ceramic substrates, Au and Ag-Pd contact pads, chip caps and resistors, inductors, quartz crystals, oscillators, making or repairing conductive traces on the PCB, EmI/RF shielding of the package, near-hermetic sealing, component or package grounding. Packages like DIP or TO-can format.
- PCB level; COB die attach, substrates can be rigid like FR4 and BT, or flex like Kapton.
- Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/.
- Designed to withstand TC wire bonding temperatures or hybrid lid-seal processes exceeding 300 degrees Celsius.
| SKU | LH27D |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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