Epo-Tek H70E Advantages and Suggested Application Notes:
- Heat-sinking adhesive. It is particularly recommended for thermal management applications where good heat dissipation is necessary.
- The excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
- Easy to use. It can be screen printed, machine dispensed, stamped or hand applied.
- Die-attach adhesive designed to be used in the 300 degree Celsius range to resist TC wire bonding operations. Meets JEDEC Level III and II packaging criteria.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass ceramic, kovar and PCB.
- Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
- Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/.
| SKU | LH70E |
|---|---|
| Hazardous Materials | No |
| Product Brand | --- None --- |
| Featured Product | No |
| Featured Order | No |
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